Toray KP Films offers products of the high quality through its Vacuum Deposition technology,
slit processing, and KP seduce materials.
HOME > Product guide > Classification by technology：Vacuum Deposition
- Vacuum Deposition
- Slit
- Surface improvement
- Coating
- Laminate
- Vacuum Deposition film for Capacitors
- Vacuum Deposition film for magnetic wave shields
- Vacuum Deposition film for printed boards
- Vacuum Deposition film for ultra-thin foil transfer
- Vacuum Deposition film for ECM
- Vacuum Deposition film for electric cables
- Vacuum Deposition film for decorative uses
- Heat-resistant coating film for electric cables
- Masking tape for Capacitors
- Heat-resistant hot melt grew coated tape
Vacuum Deposition
Vacuum Deposition is possible with thick films (20,000 Å, or 2 microns), which had been thought to be impossible.
Thin film Vacuum Deposition
The application of the Capacitor Vacuum Deposition technology we developed enables metallic processing for thin base materials. In addition to such ultra-thin films as 0.9 µm PET, 1.2 µm PPS, 2.5 µm PP, and such films as 6.0 µm Cu foil, it also enables Vacuum Deposition for thin base materials (films and metal foil), which other companies cannot provide.
In addition to the base material (film and metal foil), the Vacuum Deposition film thickness can be controlled with exceptional accuracy. It is supposed to be extremely difficult to control the accuracy of Vacuum Deposition films, but our technology enables control at an ultra-thin level. It is also possible to develop optical uses for this technology by controlling permeable and semi-permeable visible light rays.
Pattern Vacuum Deposition / Large metal areas
A special process is performed on the metal’s Vacuum Deposition surface, enabling Vacuum Deposition that will form a pattern. We are capable of creating a wide range of patterns to fulfill the users’ objective.
Pattern Vacuum Deposition / Small metal areas
We can achieve exceptionally detailed pattern Vacuum Deposition by using the technology we developed for pattern Vacuum Deposition in Capacitor film. We also are capable of producing antenna circuits for wireless LANs and other applications, and electromagnetic wave shield uses by employing visible light permeability in pattern Vacuum Deposition with an extremely detailed pitch (0.2 mm x 0.2 mm) for squares, diamonds, mesh, or other printed patterns.
Vacuum Deposition for precious metals
We can also handle Vacuum Deposition for precious metals with exceptional electrical characteristics.
Vacuum Deposition for metals with high boiling point
Our EB-type Vacuum Deposition using ultra-high power outputs has enabled us to develop Vacuum Deposition technology for metals with a high boiling point (titanium, nickel, titanium oxide, etc.) and ceramics (silicon) which were impossible with conventional Vacuum Deposition facilities.
Titanium, nickel, etc. are used with extremely thin base materials (1.2 µm) for the vibrating plates in ultra-small microphones in cellular telephones, digital cameras, etc. We have added the technology to control the permeability rate for visible light rays in the Vacuum Deposition of titanium oxide that is applied for oxygen plasma. We are also proceeding with the research and development of transparent Vacuum Deposition for holograms to prevent the counterfeiting of passports, credit cards, and gift certificates, as well as that used for solar cells.
Vacuum Deposition for ceramics
Metal oxide Vacuum Deposition, which requires processing at high temperatures, is also possible.
The primary ceramics include barium titanate, which conducts electricity, and zinc oxide, which is a semiconductor.
High-adhesion Vacuum Deposition
The technology we have developed over many years gives us the capability for Vacuum Deposition with high adhesion. This enables us to respond to a variety of needs for printed boards.
While it depends on the materials and the metal, our technology has advanced to the point which components can undergo Vacuum Deposition at one kilogram per centimeter.
Ultra-low-adhesion Vacuum Deposition
In addition, we have the capability for Vacuum Deposition with low adhesion, used for peeling and transfers, by applying our adhesion control technology.
Multi-layer Vacuum Deposition (Different metals)
Multi-layer Vacuum Deposition for different metals on the vapor deposit metal itself is also possible, with no loss of adhesion.
For example, nickel Vacuum Deposition for rust proofing purposes, tin Vacuum Deposition for improved solderability, etc. are possible on copper Vacuum Deposition.
